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TSV CMP Contract Processing

Successfully reduced processing time! It is now possible to minimize dishing to the extreme.

We offer "TSV CMP Contract Processing." By applying a CMP process using a slurry that ensures nearly 10 times the processing speed compared to the Cu slurry typically used for semiconductor Cu CMP, we can complete processing in a short time. With our CMP contract processing, we have achieved ultra-high precision and low cost through the establishment of ultra-fast Cu CMP. 【Features】 ■ Reduced processing time ■ Contributes to improved processing accuracy ■ Ultra-fast Cu CMP process ■ Minimization of dishing ■ Achieves ultra-high precision and low cost *For more details, please refer to the PDF document or feel free to contact us.

Company：D-process
Price：Other

Processing Contract

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Pre-joining CMP contract processing

We ensure the surface roughness required by the customer and enable room temperature bonding.

We offer "pre-bond CMP contract processing" at our company. As an example of our processing achievements in pre-bond CMP, we can work with materials used in semiconductors and compound semiconductors such as Si, Cu, W, Ta, TaN, SiO2, TEOS, GaAs, SiC, GaN, and InP. We are capable of both homogeneous bonding and bonding between these different materials. Before processing your wafers through our CMP contract processing, we will meet your needs with reliable technology backed by numerous in-house experiments. 【Example of Processing Achievements】 ■ Single Crystal Oxides - LiNbO3, LiTaO3, Al2O3 (Sapphire), etc. ■ Polycrystalline Materials - Poly-Si, SiC, Al2O3/YAG, etc. ■ Metals - Au, Pt, Ag, Cu, Ti, TiN, Ni, W, Al, Sn, Pb, Zn, etc. ■ Ceramics - Alumina, Ferrite, Zirconia *For more details, please refer to the PDF document or feel free to contact us.